Basic Soldering

The Basic Soldering Course is a modularized curriculum that can be customized to fit your company requirements.

Training Modules Include:

Module 1: Component Identification
This module covers both through-hole and surface mount component identification. The Through-hole component section will cover the identification of axial and radial leaded devices such as, resistors, capacitor, diodes, rectifiers, transistors, dual in-line packages, and flat packs (IC's). Polarity, value, tolerance and orientation of each type of component will also be addressed. The surface mount component identification section will cover chip resistor and capacitors, MELF resistors and diodes, tantalum capacitors, SOIC's, PLCC's, QFP's, and BGA's. Polarity, value, tolerance and orientation will also be discussed.

Module 2: Electrostatic Discharge (ESD)
This module covers the principles of static electricity, damage caused by ESD, Susceptibility of items to ESD and ESD protective materials and equipment. Topic such as conductive protective materials, static dissipative protective materials, anti-static protective materials, storage containers, handling and storage of parts, personnel ground straps, personnel apparel, grounded work benches, and Ionizers/humidifiers will be covered.

Module 3: Tools & Equipment
This module covers the use and care of tools and equipment used in the manufacturing of printed wiring assemblies. Tools and equipment discussed during this module will be wire strippers, holding devices, bending tools, clinching tools, wire and lead cutting tools, heat sources, thermal shunts, magnification aids, solder pots and soldering iron care and maintenance.

Module 4: Materials
This module covers the common materials used in the manufacturing of printed wiring assemblies. Topics include solder, flux (types, purpose, cleaning methods), cleaning agents, temporary maskants, conformal coatings (types), spacers, and adhesives.

Module 5: Preparing to Solder
This module provides the student with a basic understand of solderability, fundamental requirements for a good solder connection, material selection concerns (solder wire diameter, use of external flux etc.), soldering iron tip and temperature selection and solder wetting criteria.

Module 6: Wires and Terminals
This module covers stripping of stranded wires using both mechanical and thermal strippers, tinning of stranded wires using the solder pot and soldering iron, wrapping of wires onto terminals, soldering of terminals (turret, bifurcated, hook, pierced, gold cup) and inspection criteria.

Module 7: Through-hole Soldering
This module covers assembly, soldering, inspection and cleaning of through-hole components onto a printed wiring assembly. Topic include, lead preparation and forming, component insertion, lead cutting, soldering (tip selection, soldering iron temperature, importance of a heat bridge), inspection criteria and cleaning methods.

Module 8: SMT Soldering
This module covers surface mount soldering including set-up and preparation, component positioning and soldering (chip components, gull wing components, J-Lead components), and inspection criteria.

Module 9: Localized Cleaning
This module cover the reasons why cleaning is important, types of contamination, results of improper cleaning, common cleaning methods (Interim, Aqueous) and inspection criteria.

Module 10: Basic Through-Hole and SMT Rework
This module covers basic through-hole and SMT rework. Topics include a discussion of thermal mass, surface conditions, thermal linkage, rework using wick and vacuum extraction, and through-hole/SMT rework techniques.