STI announces that ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has delivered a complex, ruggedized PC board to STI Electronics, Inc. (STI) designed to meet the unique temperature, reliability, performance, vibration and G-force requirements for a space application. EI, with support from STI, developed a unique method of fabricating a double sided PC board with a single tier cavity on a 50 mil copper core.  The single tier design allows STI to wire bond their semiconductor module, also fabricated by EI, to the copper core, which in turn provides both heat dissipation and rigidity. 

“EI has successfully completed the substrate fabrication of STI’s new IC/DT^® prototype using STI’s patented packaging technology Imbedded Component/Die Technology (IC/DT^®) and patented design guidelines (US Patent No 7,116,557),” stated Casey Cooper, Electrical Engineering Manager at STI.

“Our engineering and process teams appreciate the opportunity to collaborate on this project.  With STI’s assistance, many technical challenges were overcome, allowing us to ship these boards well ahead of schedule and to have passed STI’s assembly test requirements,” commented Ash Bhatt, New Products Program Manager at EI.

“STI is pleased to assist EI with the challenges of multiple cavity/multiple tier designs by sharing our expertise in the successful design and fabrication of similar boards,” stated Mark McMeen, VP of Engineering Services at STI.